BE Semiconductor Industries Share Holder Equity 2010-2023 | BESIY
BE Semiconductor Industries share holder equity from 2010 to 2023. Share holder equity can be defined as the sum of preferred and common equity items
BE Semiconductor Industries Annual Share Holder Equity (Millions of US $) |
2023 |
$456 |
2022 |
$662 |
2021 |
$733 |
2020 |
$424 |
2019 |
$334 |
2018 |
$440 |
2017 |
$491 |
2016 |
$382 |
2015 |
$369 |
2014 |
$437 |
2013 |
$351 |
2012 |
$341 |
2011 |
$357 |
2010 |
$291 |
2009 |
$218 |
BE Semiconductor Industries Quarterly Share Holder Equity (Millions of US $) |
2023-12-31 |
$456 |
2023-09-30 |
$408 |
2023-06-30 |
$413 |
2023-03-31 |
$639 |
2022-12-31 |
$662 |
2022-09-30 |
$663 |
2022-06-30 |
$674 |
2022-03-31 |
$780 |
2021-12-31 |
$733 |
2021-09-30 |
$644 |
2021-06-30 |
$563 |
2021-03-31 |
$500 |
2020-12-31 |
$424 |
2020-09-30 |
$384 |
2020-06-30 |
$317 |
2020-03-31 |
$349 |
2019-12-31 |
$334 |
2019-09-30 |
$301 |
2019-06-30 |
$293 |
2019-03-31 |
$426 |
2018-12-31 |
$440 |
2018-09-30 |
$424 |
2018-06-30 |
$409 |
2018-03-31 |
$581 |
2017-12-31 |
$491 |
2017-09-30 |
$451 |
2017-06-30 |
$378 |
2017-03-31 |
$390 |
2016-12-31 |
$382 |
2016-09-30 |
$360 |
2016-06-30 |
$353 |
2016-03-31 |
$374 |
2015-12-31 |
$369 |
2015-09-30 |
$361 |
2015-06-30 |
$362 |
2015-03-31 |
$415 |
2014-12-31 |
$437 |
2014-09-30 |
$415 |
2014-06-30 |
$393 |
2014-03-31 |
$373 |
2013-12-31 |
$351 |
2013-09-30 |
$348 |
2013-06-30 |
$340 |
2013-03-31 |
$353 |
2012-12-31 |
$341 |
2012-09-30 |
$335 |
2012-06-30 |
$338 |
2012-03-31 |
$336 |
2011-12-31 |
$357 |
2011-09-30 |
$357 |
2011-06-30 |
$369 |
2011-03-31 |
$304 |
2010-12-31 |
$291 |
2010-09-30 |
$251 |
2010-06-30 |
$234 |
2010-03-31 |
$220 |
2009-12-31 |
$218 |
2009-09-30 |
$241 |
2009-06-30 |
$234 |
2009-03-31 |
$180 |
Sector |
Industry |
Market Cap |
Revenue |
Computer and Technology |
Electronics - Manufacturing Machinery |
$0.000B |
$0.626B |
BE Semiconductor Industries designs, develops, manufactures, markets and services die sorting, flip chip die-attach, molding, trim and form, singulation and plating systems for the semiconductor industry's assembly operations. Their customers consist primarily of leading U.S., European, Asian, Korean and Japanese semiconductor manufacturers and subcontractors.
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