BE Semiconductor Industries Total Liabilities 2010-2023 | BESIY
BE Semiconductor Industries total liabilities from 2010 to 2023. Total liabilities can be defined as the total value of all possible claims against the corporation.
BE Semiconductor Industries Annual Total Liabilities (Millions of US $) |
2023 |
$514 |
2022 |
$534 |
2021 |
$621 |
2020 |
$617 |
2019 |
$446 |
2018 |
$473 |
2017 |
$498 |
2016 |
$268 |
2015 |
$112 |
2014 |
$154 |
2013 |
$102 |
2012 |
$127 |
2011 |
$129 |
2010 |
$175 |
2009 |
$158 |
BE Semiconductor Industries Quarterly Total Liabilities (Millions of US $) |
2023-12-31 |
$514 |
2023-09-30 |
$518 |
2023-06-30 |
$521 |
2023-03-31 |
$554 |
2022-12-31 |
$534 |
2022-09-30 |
$532 |
2022-06-30 |
$566 |
2022-03-31 |
$587 |
2021-12-31 |
$621 |
2021-09-30 |
$618 |
2021-06-30 |
$624 |
2021-03-31 |
$695 |
2020-12-31 |
$617 |
2020-09-30 |
$627 |
2020-06-30 |
$444 |
2020-03-31 |
$451 |
2019-12-31 |
$446 |
2019-09-30 |
$446 |
2019-06-30 |
$441 |
2019-03-31 |
$477 |
2018-12-31 |
$473 |
2018-09-30 |
$489 |
2018-06-30 |
$530 |
2018-03-31 |
$572 |
2017-12-31 |
$498 |
2017-09-30 |
$333 |
2017-06-30 |
$302 |
2017-03-31 |
$277 |
2016-12-31 |
$268 |
2016-09-30 |
$135 |
2016-06-30 |
$143 |
2016-03-31 |
$127 |
2015-12-31 |
$112 |
2015-09-30 |
$117 |
2015-06-30 |
$126 |
2015-03-31 |
$164 |
2014-12-31 |
$154 |
2014-09-30 |
$158 |
2014-06-30 |
$166 |
2014-03-31 |
$133 |
2013-12-31 |
$102 |
2013-09-30 |
$114 |
2013-06-30 |
$139 |
2013-03-31 |
$145 |
2012-12-31 |
$127 |
2012-09-30 |
$133 |
2012-06-30 |
$146 |
2012-03-31 |
$125 |
2011-12-31 |
$129 |
2011-09-30 |
$143 |
2011-06-30 |
$139 |
2011-03-31 |
$175 |
2010-12-31 |
$175 |
2010-09-30 |
$171 |
2010-06-30 |
$163 |
2010-03-31 |
$160 |
2009-12-31 |
$158 |
2009-09-30 |
$148 |
2009-06-30 |
$141 |
2009-03-31 |
$108 |
Sector |
Industry |
Market Cap |
Revenue |
Computer and Technology |
Electronics - Manufacturing Machinery |
$0.000B |
$0.626B |
BE Semiconductor Industries designs, develops, manufactures, markets and services die sorting, flip chip die-attach, molding, trim and form, singulation and plating systems for the semiconductor industry's assembly operations. Their customers consist primarily of leading U.S., European, Asian, Korean and Japanese semiconductor manufacturers and subcontractors.
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