BE Semiconductor Industries Long Term Debt 2010-2023 | BESIY
BE Semiconductor Industries long term debt from 2010 to 2023. Long term debt can be defined as the sum of all long term debt fields.
BE Semiconductor Industries Annual Long Term Debt
(Millions of US $) |
| 2023 |
$322 |
| 2022 |
$340 |
| 2021 |
$357 |
| 2020 |
$457 |
| 2019 |
$310 |
| 2018 |
$321 |
| 2017 |
$302 |
| 2016 |
$136 |
| 2015 |
$15 |
| 2014 |
$4 |
| 2013 |
$4 |
| 2012 |
$2 |
| 2011 |
$1 |
| 2010 |
$37 |
| 2009 |
$52 |
BE Semiconductor Industries Quarterly Long Term Debt
(Millions of US $) |
| 2023-12-31 |
$322 |
| 2023-09-30 |
$327 |
| 2023-06-30 |
$332 |
| 2023-03-31 |
$340 |
| 2022-12-31 |
$340 |
| 2022-09-30 |
$322 |
| 2022-06-30 |
$338 |
| 2022-03-31 |
$325 |
| 2021-12-31 |
$357 |
| 2021-09-30 |
$357 |
| 2021-06-30 |
$367 |
| 2021-03-31 |
$470 |
| 2020-12-31 |
$457 |
| 2020-09-30 |
$474 |
| 2020-06-30 |
$301 |
| 2020-03-31 |
$307 |
| 2019-12-31 |
$310 |
| 2019-09-30 |
$306 |
| 2019-06-30 |
$308 |
| 2019-03-31 |
$310 |
| 2018-12-31 |
$321 |
| 2018-09-30 |
$315 |
| 2018-06-30 |
$321 |
| 2018-03-31 |
$330 |
| 2017-12-31 |
$302 |
| 2017-09-30 |
$144 |
| 2017-06-30 |
$136 |
| 2017-03-31 |
$131 |
| 2016-12-31 |
$136 |
| 2016-09-30 |
$12 |
| 2016-06-30 |
$15 |
| 2016-03-31 |
$15 |
| 2015-12-31 |
$15 |
| 2015-09-30 |
$4 |
| 2015-06-30 |
$3 |
| 2015-03-31 |
$3 |
| 2014-12-31 |
$4 |
| 2014-09-30 |
$4 |
| 2014-06-30 |
$4 |
| 2014-03-31 |
$4 |
| 2013-12-31 |
$4 |
| 2013-09-30 |
$4 |
| 2013-06-30 |
$3 |
| 2013-03-31 |
$3 |
| 2012-12-31 |
$2 |
| 2012-09-30 |
$2 |
| 2012-06-30 |
$2 |
| 2012-03-31 |
$1 |
| 2011-12-31 |
$1 |
| 2011-09-30 |
$1 |
| 2011-06-30 |
$1 |
| 2011-03-31 |
$1 |
| 2010-12-31 |
$37 |
| 2010-09-30 |
$36 |
| 2010-06-30 |
$37 |
| 2010-03-31 |
$41 |
| 2009-12-31 |
$52 |
| 2009-09-30 |
$53 |
| 2009-06-30 |
$51 |
| 2009-03-31 |
$50 |
| Sector |
Industry |
Market Cap |
Revenue |
| Computer and Technology |
Electronics - Manufacturing Machinery |
$0.000B |
$0.626B |
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BE Semiconductor Industries designs, develops, manufactures, markets and services die sorting, flip chip die-attach, molding, trim and form, singulation and plating systems for the semiconductor industry's assembly operations. Their customers consist primarily of leading U.S., European, Asian, Korean and Japanese semiconductor manufacturers and subcontractors.
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