BE Semiconductor Industries - 13 Year Stock Price History | BESIY
Historical daily share price chart and data for BE Semiconductor Industries since 2013 adjusted for splits and dividends. The latest closing stock price for BE Semiconductor Industries as of June 10, 2026 is 333.60.
- The all-time high BE Semiconductor Industries stock closing price was 336.84 on June 09, 2026.
- The BE Semiconductor Industries 52-week high stock price is 345.56, which is 3.6% above the current share price.
- The BE Semiconductor Industries 52-week low stock price is 123.40, which is 63% below the current share price.
- The average BE Semiconductor Industries stock price for the last 52 weeks is 190.81.
| BE Semiconductor Industries Historical Annual Stock Price Data | ||||||
|---|---|---|---|---|---|---|
| Year | Average Stock Price | Year Open | Year High | Year Low | Year Close | Annual % Change |
| 2026 | 241.2422 | 174.0910 | 336.8400 | 174.0910 | 333.6000 | 113.74% |
| 2025 | 135.1718 | 135.8620 | 171.9100 | 85.3561 | 156.0760 | 17.31% |
| 2024 | 137.9310 | 141.7000 | 185.8380 | 103.2640 | 133.0480 | -7.59% |
| 2023 | 96.4298 | 57.1532 | 147.3440 | 57.1532 | 143.9830 | 158.68% |
| 2022 | 55.9492 | 73.9541 | 83.7631 | 37.8095 | 55.6612 | -24.87% |
| 2021 | 70.9103 | 52.7125 | 85.1247 | 51.4762 | 74.0826 | 44.31% |
| 2020 | 35.9591 | 32.9587 | 51.4288 | 19.9900 | 51.3341 | 61.51% |
| 2019 | 23.8126 | 15.3130 | 32.1403 | 15.3130 | 31.7837 | 95.95% |
| 2018 | 23.7200 | 30.4753 | 38.7055 | 13.8447 | 16.2207 | -45.43% |
| 2017 | 21.8430 | 12.1456 | 30.3964 | 12.0003 | 29.7267 | 162.44% |
| 2016 | 9.9896 | 6.2512 | 12.0467 | 5.9938 | 11.3269 | 66.91% |
| 2015 | 8.2280 | 6.8201 | 10.6253 | 4.8630 | 6.7863 | -4.07% |
| 2014 | 5.4545 | 3.4747 | 7.1896 | 3.4682 | 7.0739 | 101.37% |
| Sector | Industry | Market Cap | Revenue |
|---|---|---|---|
| Computer and Technology | Electronics - Manufacturing Machinery | $18.048B | $0.669B |
| BE Semiconductor Industries designs, develops, manufactures, markets and services die sorting, flip chip die-attach, molding, trim and form, singulation and plating systems for the semiconductor industry's assembly operations. Their customers consist primarily of leading U.S., European, Asian, Korean and Japanese semiconductor manufacturers and subcontractors. | |||
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