BE Semiconductor Industries Gross Profit 2010-2023 | BESIY
BE Semiconductor Industries gross profit from 2010 to 2023. Gross profit can be defined as the profit a company makes after deducting the variable costs directly associated with making and selling its products or providing its services.
BE Semiconductor Industries Annual Gross Profit (Millions of US $) |
2023 |
$407 |
2022 |
$467 |
2021 |
$529 |
2020 |
$295 |
2019 |
$223 |
2018 |
$352 |
2017 |
$383 |
2016 |
$212 |
2015 |
$189 |
2014 |
$220 |
2013 |
$135 |
2012 |
$140 |
2011 |
$182 |
2010 |
$184 |
2009 |
$57 |
BE Semiconductor Industries Quarterly Gross Profit (Millions of US $) |
2023-12-31 |
$112 |
2023-09-30 |
$87 |
2023-06-30 |
$116 |
2023-03-31 |
$92 |
2022-12-31 |
$86 |
2022-09-30 |
$105 |
2022-06-30 |
$139 |
2022-03-31 |
$137 |
2021-12-31 |
$111 |
2021-09-30 |
$148 |
2021-06-30 |
$169 |
2021-03-31 |
$100 |
2020-12-31 |
$76 |
2020-09-30 |
$77 |
2020-06-30 |
$85 |
2020-03-31 |
$57 |
2019-12-31 |
$58 |
2019-09-30 |
$55 |
2019-06-30 |
$58 |
2019-03-31 |
$52 |
2018-12-31 |
$58 |
2018-09-30 |
$79 |
2018-06-30 |
$109 |
2018-03-31 |
$108 |
2017-12-31 |
$100 |
2017-09-30 |
$110 |
2017-06-30 |
$107 |
2017-03-31 |
$65 |
2016-12-31 |
$53 |
2016-09-30 |
$53 |
2016-06-30 |
$63 |
2016-03-31 |
$43 |
2015-12-31 |
$55 |
2015-09-30 |
$39 |
2015-06-30 |
$55 |
2015-03-31 |
$52 |
2014-12-31 |
$49 |
2014-09-30 |
$62 |
2014-06-30 |
$69 |
2014-03-31 |
$42 |
2013-12-31 |
$27 |
2013-09-30 |
$34 |
2013-06-30 |
$38 |
2013-03-31 |
$34 |
2012-12-31 |
$26 |
2012-09-30 |
$38 |
2012-06-30 |
$46 |
2012-03-31 |
$29 |
2011-12-31 |
$40 |
2011-09-30 |
$42 |
2011-06-30 |
$53 |
2011-03-31 |
$50 |
2010-12-31 |
$52 |
2010-09-30 |
$61 |
2010-06-30 |
$44 |
2010-03-31 |
$26 |
2009-12-31 |
$16 |
2009-09-30 |
$26 |
2009-06-30 |
$16 |
2009-03-31 |
$3 |
Sector |
Industry |
Market Cap |
Revenue |
Computer and Technology |
Electronics - Manufacturing Machinery |
$0.000B |
$0.626B |
BE Semiconductor Industries designs, develops, manufactures, markets and services die sorting, flip chip die-attach, molding, trim and form, singulation and plating systems for the semiconductor industry's assembly operations. Their customers consist primarily of leading U.S., European, Asian, Korean and Japanese semiconductor manufacturers and subcontractors.
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