BE Semiconductor Industries Shares Outstanding 2010-2023 | BESIY
BE Semiconductor Industries shares outstanding from 2010 to 2023. Shares outstanding can be defined as the number of shares held by shareholders (including insiders) assuming conversion of all convertible debt, securities, warrants and options. This metric excludes the company's treasury shares.
BE Semiconductor Industries Annual Shares Outstanding (Millions of Shares) |
2023 |
83 |
2022 |
86 |
2021 |
85 |
2020 |
84 |
2019 |
83 |
2018 |
85 |
2017 |
82 |
2016 |
77 |
2015 |
77 |
2014 |
76 |
2013 |
75 |
2012 |
75 |
2011 |
73 |
2010 |
79 |
2009 |
67 |
BE Semiconductor Industries Quarterly Shares Outstanding (Millions of Shares) |
2023-12-31 |
83 |
2023-09-30 |
82 |
2023-06-30 |
83 |
2023-03-31 |
84 |
2022-12-31 |
86 |
2022-09-30 |
86 |
2022-06-30 |
86 |
2022-03-31 |
85 |
2021-12-31 |
85 |
2021-09-30 |
85 |
2021-06-30 |
85 |
2021-03-31 |
85 |
2020-12-31 |
84 |
2020-09-30 |
84 |
2020-06-30 |
83 |
2020-03-31 |
83 |
2019-12-31 |
83 |
2019-09-30 |
83 |
2019-06-30 |
83 |
2019-03-31 |
84 |
2018-12-31 |
85 |
2018-09-30 |
84 |
2018-06-30 |
85 |
2018-03-31 |
85 |
2017-12-31 |
82 |
2017-09-30 |
81 |
2017-06-30 |
81 |
2017-03-31 |
82 |
2016-12-31 |
77 |
2016-09-30 |
76 |
2016-06-30 |
77 |
2016-03-31 |
77 |
2015-12-31 |
77 |
2015-09-30 |
77 |
2015-06-30 |
77 |
2015-03-31 |
77 |
2014-12-31 |
77 |
2014-09-30 |
76 |
2014-06-30 |
76 |
2014-03-31 |
75 |
2013-12-31 |
75 |
2013-09-30 |
75 |
2013-06-30 |
75 |
2013-03-31 |
75 |
2012-12-31 |
75 |
2012-09-30 |
76 |
2012-06-30 |
75 |
2012-03-31 |
75 |
2011-12-31 |
75 |
2011-09-30 |
76 |
2011-06-30 |
71 |
2011-03-31 |
79 |
2010-12-31 |
79 |
2010-09-30 |
79 |
2010-06-30 |
79 |
2010-03-31 |
68 |
2009-12-31 |
67 |
2009-09-30 |
62 |
2009-06-30 |
82 |
2009-03-31 |
62 |
Sector |
Industry |
Market Cap |
Revenue |
Computer and Technology |
Electronics - Manufacturing Machinery |
$0.000B |
$0.626B |
BE Semiconductor Industries designs, develops, manufactures, markets and services die sorting, flip chip die-attach, molding, trim and form, singulation and plating systems for the semiconductor industry's assembly operations. Their customers consist primarily of leading U.S., European, Asian, Korean and Japanese semiconductor manufacturers and subcontractors.
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