Alpha And Omega Semiconductor Long Term Debt 2010-2024 | AOSL

Alpha And Omega Semiconductor long term debt from 2010 to 2024. Long term debt can be defined as the sum of all long term debt fields.
Alpha And Omega Semiconductor Annual Long Term Debt
(Millions of US $)
2024 $29
2023 $42
2022 $46
2021 $91
2020 $127
2019 $103
2018 $84
2017 $1
2016 $2
2015 $
2014 $1
2013 $14
2012 $18
2011 $0
2010 $0
2009 $10
Alpha And Omega Semiconductor Quarterly Long Term Debt
(Millions of US $)
2024-09-30 $26
2024-06-30 $29
2024-03-31 $32
2023-12-31 $35
2023-09-30 $38
2023-06-30 $42
2023-03-31 $45
2022-12-31 $48
2022-09-30 $51
2022-06-30 $46
2022-03-31 $58
2021-12-31 $14
2021-09-30 $85
2021-06-30 $91
2021-03-31 $107
2020-12-31 $114
2020-09-30 $124
2020-06-30 $127
2020-03-31 $105
2019-12-31 $111
2019-09-30 $94
2019-06-30 $103
2019-03-31 $111
2018-12-31 $88
2018-09-30 $92
2018-06-30 $84
2018-03-31 $11
2017-12-31 $0
2017-09-30 $1
2017-06-30 $1
2017-03-31 $1
2016-12-31 $1
2016-09-30 $1
2016-06-30 $2
2016-03-31 $0
2015-12-31 $0
2015-09-30 $0
2015-06-30
2015-03-31 $0
2014-12-31 $1
2014-09-30 $1
2014-06-30 $1
2014-03-31 $12
2013-12-31 $12
2013-09-30 $13
2013-06-30 $14
2013-03-31 $15
2012-12-31 $16
2012-09-30 $17
2012-06-30 $18
2012-03-31 $0
2011-12-31 $0
2011-09-30 $0
2011-06-30 $0
2011-03-31 $0
2010-12-31 $0
2010-09-30 $0
2010-06-30 $0
2010-03-31 $1
2009-12-31
2009-09-30
2009-06-30
2009-03-31
Sector Industry Market Cap Revenue
Computer and Technology Semiconductors $1.115B $0.657B
Alpha and Omega Semiconductor Limited is engaged in designing, developing and supplying a broad range of power semiconductors globally, including a portfolio of Power MOSFET and Power IC products. The Company seeks to differentiate itself by integrating its expertise in device physics, process technology, design and advanced packaging to optimize product performance and cost. Its portfolio of products targets high-volume end-market applications, such as notebooks, netbooks, flat panel displays, mobile phone battery packs, set-top boxes, portable media players and power supplies. The products are incorporated into devices by original equipment manufacturers, or OEMs. The Company utilizes third-party foundries for all of its wafer fabrication and it deploys and implements its proprietary MOSFET processes at these third party foundries. The Company relies upon its in-house capacity and an associated provider for most of its packaging and testing requirements.
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