Alpha And Omega Semiconductor Cash on Hand 2012-2026 | AOSL

Alpha And Omega Semiconductor cash on hand from 2012 to 2026. Cash on hand can be defined as cash deposits at financial institutions that can immediately be withdrawn at any time, and investments maturing in one year or less that are highly liquid and therefore regarded as cash equivalents and reported with or near cash line items.
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Alpha And Omega Semiconductor Annual Cash on Hand
(Millions of US $)
2026 $181
2025 $153
2024 $176
2023 $196
2022 $315
2021 $203
2020 $161
2019 $122
2018 $132
2017 $116
2016 $88
2015 $106
2014 $118
2013 $93
2012 $82
Alpha And Omega Semiconductor Quarterly Cash on Hand
(Millions of US $)
2026-06-30 $181
2026-03-31 $191
2025-12-31 $197
2025-09-30 $224
2025-06-30 $153
2025-03-31 $170
2024-12-31 $183
2024-09-30 $176
2024-06-30 $176
2024-03-31 $175
2023-12-31 $162
2023-09-30 $194
2023-06-30 $196
2023-03-31 $266
2022-12-31 $288
2022-09-30 $316
2022-06-30 $315
2022-03-31 $323
2021-12-31 $270
2021-09-30 $253
2021-06-30 $203
2021-03-31 $192
2020-12-31 $181
2020-09-30 $157
2020-06-30 $161
2020-03-31 $113
2019-12-31 $109
2019-09-30 $103
2019-06-30 $122
2019-03-31 $139
2018-12-31 $147
2018-09-30 $113
2018-06-30 $132
2018-03-31 $125
2017-12-31 $146
2017-09-30 $181
2017-06-30 $116
2017-03-31 $116
2016-12-31 $123
2016-09-30 $119
2016-06-30 $88
2016-03-31 $79
2015-12-31 $82
2015-09-30 $73
2015-06-30 $106
2015-03-31 $113
2014-12-31 $121
2014-09-30 $118
2014-06-30 $118
2014-03-31 $111
2013-12-31 $103
2013-09-30 $96
2013-06-30 $93
2013-03-31 $104
2012-12-31 $92
2012-09-30 $95
2012-06-30 $82
2012-03-31 $79
2011-12-31 $97
2011-09-30 $88
Sector Industry Market Cap Revenue
Computer and Technology Semiconductors $0.749B $0.679B
Alpha and Omega Semiconductor Limited is engaged in designing, developing and supplying a broad range of power semiconductors globally, including a portfolio of Power MOSFET and Power IC products. The Company seeks to differentiate itself by integrating its expertise in device physics, process technology, design and advanced packaging to optimize product performance and cost. Its portfolio of products targets high-volume end-market applications, such as notebooks, netbooks, flat panel displays, mobile phone battery packs, set-top boxes, portable media players and power supplies. The products are incorporated into devices by original equipment manufacturers, or OEMs. The Company utilizes third-party foundries for all of its wafer fabrication and it deploys and implements its proprietary MOSFET processes at these third party foundries. The Company relies upon its in-house capacity and an associated provider for most of its packaging and testing requirements.
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