Tower Semiconductor Pre-Paid Expenses 2010-2024 | TSEM
Tower Semiconductor pre-paid expenses from 2010 to 2024. Pre-paid expenses can be defined as a current asset created by prepayment of costs and expenses for which the benefits will occur at a future date.
| Tower Semiconductor Annual Pre-Paid Expenses (Millions of US $) |
|
|---|---|
| 2024 | $0 |
| 2023 | $0 |
| 2022 | $0 |
| 2021 | $0 |
| 2020 | $0 |
| 2019 | $0 |
| 2018 | $0 |
| 2017 | $0 |
| 2016 | $0 |
| 2015 | $0 |
| 2014 | $0 |
| 2013 | $0 |
| 2012 | $0 |
| 2011 | $0 |
| 2010 | $0 |
| 2009 | $0 |
| Tower Semiconductor Quarterly Pre-Paid Expenses (Millions of US $) |
|
|---|---|
| 2024-12-31 | |
| 2024-09-30 | |
| 2024-06-30 | |
| 2024-03-31 | |
| 2023-12-31 | |
| 2023-09-30 | |
| 2023-06-30 | |
| 2023-03-31 | |
| 2022-12-31 | |
| 2022-09-30 | |
| 2022-06-30 | |
| 2022-03-31 | |
| 2021-12-31 | |
| 2021-09-30 | |
| 2021-06-30 | |
| 2021-03-31 | |
| 2020-12-31 | |
| 2020-09-30 | |
| 2020-06-30 | |
| 2020-03-31 | |
| 2019-12-31 | |
| 2019-09-30 | |
| 2019-06-30 | |
| 2019-03-31 | |
| 2018-12-31 | |
| 2018-09-30 | |
| 2018-06-30 | |
| 2018-03-31 | |
| 2017-12-31 | |
| 2017-09-30 | |
| 2017-06-30 | |
| 2017-03-31 | |
| 2016-12-31 | |
| 2016-09-30 | |
| 2016-06-30 | |
| 2016-03-31 | |
| 2015-12-31 | |
| 2015-09-30 | |
| 2015-06-30 | |
| 2015-03-31 | |
| 2014-12-31 | |
| 2014-09-30 | |
| 2014-06-30 | |
| 2014-03-31 | |
| 2013-12-31 | |
| 2013-09-30 | |
| 2013-06-30 | |
| 2013-03-31 | |
| 2012-12-31 | |
| 2012-09-30 | |
| 2012-06-30 | |
| 2012-03-31 | |
| 2011-12-31 | |
| 2011-09-30 | |
| 2011-06-30 | |
| 2011-03-31 | |
| 2010-12-31 | |
| 2010-09-30 | |
| 2010-06-30 | |
| 2010-03-31 | |
| 2009-12-31 | |
| 2009-09-30 | |
| 2009-06-30 | |
| 2009-03-31 | |
| Sector | Industry | Market Cap | Revenue |
|---|---|---|---|
| Computer and Technology | ELEC COMP-SEMIC | $4.133B | $1.436B |
| Tower Semiconductor Ltd. is an independent manufacturer and service provider of semiconductor integrated circuits on silicon wafers. They provide IC design, manufacturing and turnkey services using advanced production capabilities and the proprietary IC designs of their customers, and are specializing in providing solutions for embedded non-volatile memory devices and CMOS image sensors. (press release) | |||