Benchmark Electronics Shares Outstanding 2010-2023 | BHE

Benchmark Electronics shares outstanding from 2010 to 2023. Shares outstanding can be defined as the number of shares held by shareholders (including insiders) assuming conversion of all convertible debt, securities, warrants and options. This metric excludes the company's treasury shares.
Benchmark Electronics Annual Shares Outstanding
(Millions of Shares)
2023 36
2022 36
2021 36
2020 37
2019 39
2018 47
2017 50
2016 50
2015 52
2014 54
2013 55
2012 57
2011 60
2010 63
2009 65
Benchmark Electronics Quarterly Shares Outstanding
(Millions of Shares)
2023-12-31 36
2023-09-30 36
2023-06-30 36
2023-03-31 36
2022-12-31 36
2022-09-30 35
2022-06-30 35
2022-03-31 35
2021-12-31 36
2021-09-30 36
2021-06-30 36
2021-03-31 37
2020-12-31 37
2020-09-30 37
2020-06-30 36
2020-03-31 37
2019-12-31 39
2019-09-30 38
2019-06-30 39
2019-03-31 41
2018-12-31 47
2018-09-30 46
2018-06-30 48
2018-03-31 49
2017-12-31 50
2017-09-30 50
2017-06-30 50
2017-03-31 50
2016-12-31 50
2016-09-30 49
2016-06-30 50
2016-03-31 50
2015-12-31 52
2015-09-30 52
2015-06-30 53
2015-03-31 53
2014-12-31 54
2014-09-30 54
2014-06-30 54
2014-03-31 54
2013-12-31 55
2013-09-30 55
2013-06-30 55
2013-03-31 55
2012-12-31 57
2012-09-30 56
2012-06-30 57
2012-03-31 58
2011-12-31 60
2011-09-30 59
2011-06-30 61
2011-03-31 61
2010-12-31 63
2010-09-30 62
2010-06-30 63
2010-03-31 64
2009-12-31 65
2009-09-30 65
2009-06-30 65
2009-03-31 65
Sector Industry Market Cap Revenue
Computer and Technology Electrical Manufacturing Services (EMS) $1.084B $2.839B
Benchmark Electronics, Inc. is a provider of electronic manufacturing services. The Company operates through three segments: the Americas, Asia and Europe. It provides services to original equipment manufacturers of industrial control equipment, including equipment for the aerospace and defense industry; telecommunication equipment; computers and related products for business enterprises; medical devices, and testing and instrumentation products. It offers integrated design and manufacturing services. Its operations consist of over three principal areas: manufacturing and assembly operations, including printed circuit boards assemblies and subsystem assembly, box build and systems integration; precision technology manufacturing, which include precision machining, metal joining, assembly and functional testing, and specialized engineering services, and specialized engineering services, such as product design, printed circuit board layout, prototyping, automation and test development.
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