Benchmark Electronics Long Term Debt 2010-2023 | BHE

Benchmark Electronics long term debt from 2010 to 2023. Long term debt can be defined as the sum of all long term debt fields.
Benchmark Electronics Annual Long Term Debt
(Millions of US $)
2023 $327
2022 $321
2021 $129
2020 $131
2019 $139
2018 $147
2017 $193
2016 $211
2015 $223
2014 $9
2013 $10
2012 $10
2011 $11
2010 $11
2009 $11
Benchmark Electronics Quarterly Long Term Debt
(Millions of US $)
2023-12-31 $327
2023-09-30 $428
2023-06-30 $424
2023-03-31 $400
2022-12-31 $321
2022-09-30 $296
2022-06-30 $262
2022-03-31 $202
2021-12-31 $129
2021-09-30 $124
2021-06-30 $127
2021-03-31 $129
2020-12-31 $131
2020-09-30 $148
2020-06-30 $165
2020-03-31 $232
2019-12-31 $139
2019-09-30 $141
2019-06-30 $143
2019-03-31 $145
2018-12-31 $147
2018-09-30 $149
2018-06-30 $182
2018-03-31 $278
2017-12-31 $193
2017-09-30 $198
2017-06-30 $202
2017-03-31 $206
2016-12-31 $211
2016-09-30 $214
2016-06-30 $235
2016-03-31 $220
2015-12-31 $223
2015-09-30 $8
2015-06-30 $8
2015-03-31 $9
2014-12-31 $9
2014-09-30 $9
2014-06-30 $9
2014-03-31 $9
2013-12-31 $10
2013-09-30 $10
2013-06-30 $10
2013-03-31 $10
2012-12-31 $10
2012-09-30 $10
2012-06-30 $10
2012-03-31 $10
2011-12-31 $11
2011-09-30 $11
2011-06-30 $11
2011-03-31 $11
2010-12-31 $11
2010-09-30 $11
2010-06-30 $11
2010-03-31 $11
2009-12-31 $11
2009-09-30 $11
2009-06-30 $12
2009-03-31 $12
Sector Industry Market Cap Revenue
Computer and Technology Electrical Manufacturing Services (EMS) $1.445B $2.839B
Benchmark Electronics, Inc. is a provider of electronic manufacturing services. The Company operates through three segments: the Americas, Asia and Europe. It provides services to original equipment manufacturers of industrial control equipment, including equipment for the aerospace and defense industry; telecommunication equipment; computers and related products for business enterprises; medical devices, and testing and instrumentation products. It offers integrated design and manufacturing services. Its operations consist of over three principal areas: manufacturing and assembly operations, including printed circuit boards assemblies and subsystem assembly, box build and systems integration; precision technology manufacturing, which include precision machining, metal joining, assembly and functional testing, and specialized engineering services, and specialized engineering services, such as product design, printed circuit board layout, prototyping, automation and test development.
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