Alpha And Omega Semiconductor Debt to Equity Ratio 2010-2018 | AOSL

Current and historical debt to equity ratio values for Alpha And Omega Semiconductor (AOSL) over the last 10 years. The debt/equity ratio can be defined as a measure of a company's financial leverage calculated by dividing its long-term debt by stockholders' equity. Alpha And Omega Semiconductor debt/equity for the three months ending December 31, 2018 was 0.20.
Alpha And Omega Semiconductor Debt/Equity Ratio Historical Data
Date Long Term Debt Shareholder's Equity Debt to Equity Ratio
2018-12-31 $0.09B $0.45B 0.20
2018-09-30 $0.09B $0.42B 0.22
2018-06-30 $0.08B $0.43B 0.20
2018-03-31 $0.01B $0.44B 0.03
2017-12-31 $0.00B $0.39B 0.00
2017-09-30 $0.00B $0.39B 0.00
2017-06-30 $0.00B $0.30B 0.00
2017-03-31 $0.00B $0.29B 0.00
2016-12-31 $0.00B $0.29B 0.00
2016-09-30 $0.00B $0.29B 0.01
2016-06-30 $0.00B $0.24B 0.01
2016-03-31 $0.00B $0.24B 0.00
2015-12-31 $0.00B $0.24B 0.00
2015-09-30 $0.00B $0.24B 0.00
2015-06-30 $0.00B $0.28B 0.00
2015-03-31 $0.00B $0.28B 0.00
2014-12-31 $0.00B $0.29B 0.00
2014-09-30 $0.00B $0.29B 0.00
2014-06-30 $0.00B $0.28B 0.00
2014-03-31 $0.01B $0.28B 0.04
2013-12-31 $0.01B $0.28B 0.04
2013-09-30 $0.01B $0.28B 0.05
2013-06-30 $0.01B $0.28B 0.05
2013-03-31 $0.02B $0.28B 0.05
2012-12-31 $0.02B $0.30B 0.05
2012-09-30 $0.02B $0.29B 0.06
2012-06-30 $0.02B $0.28B 0.06
2012-03-31 $0.00B $0.27B 0.00
2011-12-31 $0.00B $0.27B 0.00
2011-09-30 $0.00B $0.26B 0.00
2011-06-30 $0.00B $0.26B 0.00
2011-03-31 $0.00B $0.25B 0.00
2010-12-31 $0.00B $0.24B 0.00
2010-09-30 $0.00B $0.20B 0.00
2010-06-30 $0.00B $0.19B 0.00
2010-03-31 $0.00B $0.08B 0.01
2009-12-31 $0.00B $0.00B 0.00
2009-09-30 $0.00B $0.00B 0.00
2009-06-30 $0.00B $0.00B 0.00
2009-03-31 $0.00B $0.00B 0.00
Sector Industry Market Cap Revenue
Computer and Technology Semiconductors $0.307B $0.422B
Alpha and Omega Semiconductor Limited is engaged in designing, developing and supplying a broad range of power semiconductors globally, including a portfolio of Power MOSFET and Power IC products. The Company seeks to differentiate itself by integrating its expertise in device physics, process technology, design and advanced packaging to optimize product performance and cost. Its portfolio of products targets high-volume end-market applications, such as notebooks, netbooks, flat panel displays, mobile phone battery packs, set-top boxes, portable media players and power supplies. The products are incorporated into devices by original equipment manufacturers, or OEMs. The Company utilizes third-party foundries for all of its wafer fabrication and it deploys and implements its proprietary MOSFET processes at these third party foundries. The Company relies upon its in-house capacity and an associated provider for most of its packaging and testing requirements.
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