Amtech Systems Pre-Paid Expenses 2012-2026 | ASYS
Amtech Systems pre-paid expenses from 2012 to 2026. Pre-paid expenses can be defined as a current asset created by prepayment of costs and expenses for which the benefits will occur at a future date.
|
Amtech Systems Annual Pre-Paid Expenses (Millions of US $) |
|
|---|---|
| 2025 | |
| 2024 | |
| 2023 | |
| 2022 | |
| 2021 | |
| 2020 | |
| 2019 | |
| 2018 | |
| 2017 | |
| 2016 | |
| 2015 | |
| 2014 | |
| 2013 | |
| 2012 | |
| 2011 | |
|
Amtech Systems Quarterly Pre-Paid Expenses (Millions of US $) |
|
|---|---|
| 2026-03-31 | |
| 2025-12-31 | |
| 2025-09-30 | |
| 2025-06-30 | |
| 2025-03-31 | |
| 2024-12-31 | |
| 2024-09-30 | |
| 2024-06-30 | |
| 2024-03-31 | |
| 2023-12-31 | |
| 2023-09-30 | |
| 2023-06-30 | |
| 2023-03-31 | |
| 2022-12-31 | |
| 2022-09-30 | |
| 2022-06-30 | |
| 2022-03-31 | |
| 2021-12-31 | |
| 2021-09-30 | |
| 2021-06-30 | |
| 2021-03-31 | |
| 2020-12-31 | |
| 2020-09-30 | |
| 2020-06-30 | |
| 2020-03-31 | |
| 2019-12-31 | |
| 2019-09-30 | |
| 2019-06-30 | |
| 2019-03-31 | |
| 2018-12-31 | |
| 2018-09-30 | |
| 2018-06-30 | |
| 2018-03-31 | |
| 2017-12-31 | |
| 2017-09-30 | |
| 2017-06-30 | |
| 2017-03-31 | |
| 2016-12-31 | |
| 2016-09-30 | |
| 2016-06-30 | |
| 2016-03-31 | |
| 2015-12-31 | |
| 2015-09-30 | |
| 2015-06-30 | |
| 2015-03-31 | |
| 2014-12-31 | |
| 2014-09-30 | |
| 2014-06-30 | |
| 2014-03-31 | |
| 2013-12-31 | |
| 2013-09-30 | |
| 2013-06-30 | $1 |
| 2013-03-31 | $1 |
| 2012-12-31 | |
| 2012-09-30 | |
| 2012-06-30 | $1 |
| 2012-03-31 | |
| 2011-12-31 | |
| 2011-09-30 | |
| 2011-06-30 | |
| Sector | Industry | Market Cap | Revenue |
|---|---|---|---|
| Computer and Technology | Semiconductor - General | $0.213B | $0.079B |
| AMTECH SYSTEMS, INC. is engaged in the manufacture of several items of capital equipment, one of which is patented, used by customers in the manufacture of semiconductors. Co. has recently obtained a U.S. patent on technology on which it expects to base a proposed new photo chemical vapor deposition (``CVD``) product for use in semiconductor manufacturing facilities. The Company has engaged the University of California, Santa Cruz, to conduct a study to determine the feasibility of such a product. | |||
| Stock Name | Country | Market Cap | PE Ratio |
|---|---|---|---|
| NVIDIA (NVDA) | United States | $4583.709B | 41.28 |
| Intel (INTC) | United States | $311.588B | 0.00 |
| Texas Instruments (TXN) | United States | $195.504B | 39.47 |
| STMicroelectronics (STM) | Switzerland | $35.460B | 74.49 |
| Screen Holdings (DINRF) | Japan | $6.574B | 11.31 |
| SUMCO (SUOPY) | Japan | $4.406B | 0.00 |
| Thk (THKLY) | Japan | $4.302B | 95.05 |