Advanced Semiconductor Engineering Shares Outstanding 2006-2018 | ASX

Advanced Semiconductor Engineering shares outstanding history from 2006 to 2018. Shares outstanding can be defined as the number of shares held by shareholders (including insiders) assuming conversion of all convertible debt, securities, warrants and options. This metric excludes the company's treasury shares.
  • Advanced Semiconductor Engineering shares outstanding for the quarter ending September 30, 2018 were 2.128B, a 1.31% decline year-over-year.
  • Advanced Semiconductor Engineering 2017 shares outstanding were 2.092B, a 1.03% increase from 2016.
  • Advanced Semiconductor Engineering 2016 shares outstanding were 2.071B, a 0.41% increase from 2015.
  • Advanced Semiconductor Engineering 2015 shares outstanding were 2.063B, a 7.35% increase from 2014.
Advanced Semiconductor Engineering Annual Shares Outstanding
(Millions of Shares)
2017 2,092
2016 2,071
2015 2,063
2014 1,921
2013 1,877
2012 1,894
2011 1,925
2010 2,022
2009 1,768
2008 1,903
2007 1,907
2006 1,827
2005 1,887
Advanced Semiconductor Engineering Quarterly Shares Outstanding
(Millions of Shares)
Q3 2018 2,128
Q2 2018 2,126
Q1 2018 1,735
Q4 2017 2,092
Q3 2017 2,156
Q2 2017 2,151
Q1 2017 1,983
Q4 2016 2,071
Q3 2016 2,063
Q2 2016 2,060
Q1 2016 2,073
Q4 2015 1,960
Q3 2015 2,058
Q2 2015 2,038
Q1 2015 1,967
Q4 2014 1,925
Q3 2014 2,049
Q2 2014 1,959
Q1 2014 1,948
Q4 2013 1,913
Q3 2013 1,962
Q2 2013 1,910
Q1 2013 1,892
Q4 2012 1,876
Q3 2012 1,877
Q2 2012 1,897
Q1 2012 1,895
Q4 2011 1,878
Q3 2011 1,908
Q2 2011 1,888
Q1 2011 1,921
Q4 2010 1,963
Q3 2010 1,949
Q2 2010 1,909
Q1 2010 1,871
Q4 2009 1,869
Q3 2009 1,919
Q2 2009 1,800
Q1 2009 1,799
Q4 2008 1,823
Q3 2008 1,892
Q2 2008 1,382
Q1 2008 1,782
Q4 2007 2,024
Q3 2007 1,899
Q2 2007 1,772
Q1 2007 1,932
Q4 2006 1,801
Q3 2006 1,783
Q2 2006 1,808
Q1 2006 1,818
Q4 2005 1,900
Q3 2005 1,782
Q2 2005 1,795
Q1 2005 1,791
Sector Industry Market Cap Revenue
Computer and Technology Semiconductors $8.410B $9.548B
Advanced Semiconductor Engineering, Inc. is an independent provider of semiconductor packaging services and semiconductor testing services, including front-end engineering testing, wafer probing and final testing services. The company offers packaging and testing services separately and on a turnkey basis. Turnkey services consist of integrated packaging, testing and direct shipment of semiconductors to end users designated by customers. The company is able to expand the traditional scope of turnkey services to offer total semiconductor manufacturing services to customers.
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